ʻO ka hoʻonui ʻana i ke kuleana o ka hana ʻana i ka laser ma nā metala, aniani, a me nā mea ʻē aʻe

Ka Hoʻoikaika o ka Wavelong ma nā Kaʻina Hana ʻenehana Laser

ʻO ka lōʻihi o ka nalu o ka laser e hoʻoikaika nui i ke kaʻina hana, ʻoi aku hoʻi no nā mea e like me ke kila kila. ʻO nā lasers e hoʻokuʻu ana i ka ultraviolet, ʻike ʻia, kokoke a me nā wahi infrared mamao i nānā ʻia no ko lākou mana koʻikoʻi no ka hoʻoheheʻe ʻana a me ka evaporation (Lazov, Angelov, & Teirumnieks, 2019).

Nā noi like ʻole ma muli o nā lōʻihi nalu

ʻAʻole kūʻokoʻa ke koho ʻana i ka lōʻihi hawewe laser akā hilinaʻi nui i nā waiwai o ka mea a me ka hopena i makemake ʻia. No ka laʻana, maikaʻi loa nā lasers UV (me nā lōʻihi hawewe pōkole) no ke kahakaha pololei ʻana a me ka micromachining, no ka mea hiki iā lākou ke hana i nā kikoʻī ʻoi aku ka maikaʻi. ʻO kēia ka mea kūpono iā lākou no ka ʻoihana semiconductor a me microelectronics. Ma ka hoʻohālikelike ʻana, ʻoi aku ka maikaʻi o nā laser infrared no ka hoʻoili ʻana i nā mea ʻoi aku ka mānoanoa ma muli o ko lākou hiki ke komo hohonu, e kūpono ana iā lākou no nā noi ʻoihana kaumaha. (Majumdar & Manna, 2013).Pēlā, nā lasers ʻōmaʻomaʻo, e hana maʻamau i ka nalu o 532 nm, e ʻike i kā lākou niche i nā noi e koi ana i ka precision kiʻekiʻe me ka hopena wela liʻiliʻi. He mea maikaʻi loa lākou i ka microelectronics no nā hana e like me ka hoʻohālikelike kaapuni, i nā noi lapaʻau no nā kaʻina hana e like me photocoagulation, a ma ka ʻāpana ikehu hou no ka hana ʻana o nā cell solar. ʻO ka lōʻihi o ka nalu kū hoʻokahi o nā lasers ʻōmaʻomaʻo e kūpono iā lākou no ka mākaʻikaʻi ʻana a me ke kahakaha ʻana i nā mea like ʻole, me nā plastics a me nā metala, kahi e makemake ʻia ai ka ʻokoʻa kiʻekiʻe a me ka pōʻino liʻiliʻi. Hōʻike kēia adaptability o nā lasers ʻōmaʻomaʻo i ke koʻikoʻi o ke koho lōʻihi nalu i ka ʻenehana laser, e hōʻoia ana i nā hopena maikaʻi loa no nā mea kikoʻī a me nā noi.

ʻO ka525nm laser ʻōmaʻomaʻoHe ʻano kikoʻī o ka ʻenehana laser i hōʻike ʻia e kona hoʻokuʻu ʻia ʻana o nā kukui ʻōmaʻomaʻo ma ka nalu o 525 nanometers. Loaʻa nā lasers ʻōmaʻomaʻo i kēia nalu nalu i nā noi i ka photocoagulation retinal, kahi e pono ai ko lākou mana kiʻekiʻe a me ka pololei. Hiki nō hoʻi iā lākou ke hoʻohana i ka hoʻoili waiwai, ʻoi aku hoʻi i nā māla e koi ana i ka hoʻoili ʻana i ka hopena wela.ʻO ka hoʻomohala ʻana o nā diodes laser ʻōmaʻomaʻo ma ka substrate GaN c-plane i nā hawewe lōʻihi ma 524-532 nm e hōʻailona ana i kahi holomua nui i ka ʻenehana laser. He mea koʻikoʻi kēia hoʻomohala ʻana no nā noi e koi ana i nā hiʻohiʻona o ka lōʻihi nalu

Nā Nalu Hoʻomau a me nā Puna Laseri Hoʻohālikelike ʻia

Manaʻo ʻia ka nalu hoʻomau (CW) a me nā kumu laser quasi-CW ma nā ʻano nalu like ʻole e like me near-infrared (NIR) ma 1064 nm, ʻōmaʻomaʻo ma 532 nm, a me ultraviolet (UV) ma 355 nm no ka laser doping selective emitter solar cell. Loaʻa nā hawewe ʻokoʻa i nā hopena no ka hana ʻana i ka adaptability a me ka pono (Patel et al., 2011).

ʻO nā Laser Excimer no nā mea hana ākea Band Gap

ʻO nā lasers Excimer, e hana ana ma kahi lōʻihi o ka hawewe UV, kūpono no ka hoʻoponopono ʻana i nā mea ākea ākea e like me ke aniani a me ka carbon fiber-reinforced polymer (CFRP), e hāʻawi ana i ka precision kiʻekiʻe a me ka hopena wela liʻiliʻi (Kobayashi et al., 2017).

Nd:YAG Lasers no nā noi ʻoihana

Nd: ʻO nā lasers YAG, me kā lākou hiki ke hoʻololi i nā ʻōlelo o ke kani ʻana o ka nalu lōʻihi, hoʻohana ʻia i nā ʻano noi. ʻO kā lākou hiki ke hana ma 1064 nm a me 532 nm hiki ke maʻalahi i ka hana ʻana i nā mea like ʻole. No ka laʻana, he kūpono ka hawewe nalu 1064 nm no ke kahakaha hohonu ʻana ma nā metala, ʻoiai ʻo ka hawewe 532 nm e hāʻawi i ke kaha kiʻekiʻe o ka ʻili ma luna o nā plastic a me nā metala i uhi ʻia. (Moon et al., 1999).

→Huahana pili:CW Diode-pumped solid-state laser me 1064nm hawewe lōʻihi

Kiekie Fiber Laser Welding

ʻO nā lasers me nā lōʻihi hawewe kokoke i 1000 nm, loaʻa ka maikaʻi o ka beam maikaʻi a me ka mana kiʻekiʻe, hoʻohana ʻia i ka welding laser keyhole no nā metala. ʻO kēia mau lasers e hoʻoheheʻe maikaʻi a hoʻoheheʻe i nā mea, e hana ana i nā welds kiʻekiʻe (Salminen, Piili, & Purtonen, 2010).

Hoʻohui ʻia o ka ʻenehana Laser me nā ʻenehana ʻē aʻe

ʻO ka hoʻohui ʻana o ka hana laser me nā ʻenehana hana ʻē aʻe, e like me ka cladding a me ka milling, ua alakaʻi i nā ʻōnaehana hana ʻoi aku ka maikaʻi a me ka versatile. He mea maikaʻi loa kēia hoʻohui ʻana i nā ʻoihana e like me ka mea hana a me ka make a me ka hoʻoponopono ʻana i ka mīkini (Nowotny et al., 2010).